With the release of the iPhone 18 Pro series, a multitude of bloggers, institutions, and consumers who managed to get their hands on the devices wasted no time in conducting a battery of tests, disassemblies, and comparisons to uncover the strengths and weaknesses of this year's iPhone offering.

However, the feedback so far hasn't been particularly flattering. Rather than highlighting numerous advantages, there has been a deluge of complaints. Notably, after several institutions took apart the devices, it was discovered that Apple has been mixing different types of baseband chips, flash memory, and RAM.

Let's start with the baseband chips. At the launch event, Apple proudly announced that it had incorporated its self-developed C2 baseband, which boasts support for Sub-6 and millimeter-wave frequencies. The company claimed that this new baseband offers a 50% increase in speed and a 15% reduction in power consumption compared to its predecessor.

On paper, these specs seem impressive. However, upon disassembly, it was revealed that Apple's phones don't solely rely on the C2 baseband. They also contain the Qualcomm Snapdragon X80 modem. This indicates that the iPhone 18 Pro series is indeed mixing baseband chips, and it remains unclear whether this variation is region-specific or entirely random.

Moving on to flash memory, different types of storage utilize distinct types of particles. The 256GB and 512GB versions of the iPhone 18 Pro series continue to use TLC particles, while the 1TB and 2TB versions opt for QLC particles.

QLC particles are generally more cost-effective, but this comes at the expense of write speed and endurance, both of which are inferior to those of TLC particles.

Many consumers have voiced their dissatisfaction, labeling this move as a "reverse upgrade" where the more expensive versions are actually receiving inferior components. Some have even gone as far as to call it a "reverse cripple." Of course, there are those who argue that there is no discernible difference in the actual user experience.

Now, let's talk about the RAM. Apple has adopted a new packaging technology known as WMCM this time around. Compared to the previous POP technology, Apple has transitioned to a tiled structure for the DRAM memory and A20 Pro chip, whereas before they were vertically stacked.

After institutions disassembled the iPhone 18 Pro, it was discovered that Apple sources its DRAM memory from several suppliers, all of which utilize LPDDR5X technology. These suppliers include Samsung, SK Hynix, and Micron, but notably exclude Changxin Storage.

The specific version of RAM you receive appears to be a mixed bag, with no discernible pattern or distinction between different phone versions.

So, why is this happening? The consensus among observers is that it's due to supply chain constraints.

Regarding the baseband chips, Apple's previous agreement with Qualcomm is set to expire in 2026. As a result, they are still obligated to use Qualcomm's baseband chips until that time. Hence, they have procured some and incorporated them into the new phones.

As for flash memory and RAM, the situation is more dire. Storage chip prices have skyrocketed this year, making it a challenge to secure inventory. In this context, concerns about whether the chips are QLC or TLC, or whether they come from Samsung, Micron, or SK Hynix, take a backseat. As long as Apple can secure the necessary inventory without disrupting phone manufacturing, they consider it a win.