Driven by downstream demand, the global inner-layer photosensitive circuit ink market is currently exhibiting a growth trend, with the market share of LDI inner-layer photosensitive circuit ink continuously increasing.

LDI inner-layer photosensitive circuit ink is a liquid photosensitive material specifically designed for the laser direct imaging (LDI) exposure process used in inner-layer circuit pattern transfer. It is uniformly coated onto the copper foil surface using inner-layer coating methods (such as roll coating and dip coating) and, after drying to form a film, proceeds to the LDI exposure process.

Traditional inner-layer circuit fabrication requires first producing a photomask, then exposing the ink-coated substrate through the photomask using ultraviolet light. LDI technology, by contrast, eliminates the need for a physical photomask entirely; instead, a computer-controlled laser beam directly scans and exposes the photosensitive ink-coated substrate, converting digital pattern data into physical patterns. As a result, LDI inner-layer photosensitive circuit ink differs from ordinary inner-layer photosensitive circuit ink in formulation design, performance specifications, and application scenarios.

By coating method, LDI inner-layer photosensitive circuit ink can be divided into two major categories: coating type and dip coating type. The coating type uniformly applies ink to the substrate surface via roll coating or curtain coating and is suitable for large-scale mass production. The dip coating type achieves ink coverage through immersion coating, offers better fluidity and adhesion, and is suitable for the production of advanced fine circuits such as those in flexible boards, ceramic boards, and IC substrates.

Driven by downstream demand, the global inner-layer photosensitive circuit ink market is currently showing a growth trend, and the market share of LDI inner-layer photosensitive circuit ink is continuously increasing. The rapid development of industries such as AI has pushed the PCB market toward higher precision and higher density, with demand for high-layer boards, HDI boards, and IC substrates continuing to grow. Laser direct imaging technology is gradually replacing traditional photomask processes in high-end PCB production, prompting ink products to evolve toward laser-compatible and fine-circuit versions. The market size of LDI inner-layer photosensitive circuit ink is expected to surpass that of ordinary inner-layer photosensitive circuit ink in the coming years.

China is the world's largest PCB manufacturing country, with a relatively high share of production capacity. The PCB industry has driven the development of related domestic industrial chains. In the field of inner-layer photosensitive circuit ink, China is also the world's largest producer and consumer. As a high-end PCB ink product, LDI inner-layer photosensitive circuit ink has also seen domestic enterprises break through technical barriers and achieve industrialized production.

According to the "2026–2030 Global and China LDI Inner-Layer Photosensitive Circuit Ink Industry Research and 15th Five-Year Plan Analysis Report" compiled and released by Xinsijie Industry Research Center, domestic LDI inner-layer photosensitive circuit ink manufacturers include Rongda Photosensitive, Guangxin Materials, and others. Rongda Photosensitive is a domestic leader in high-end photosensitive ink, and its high-end photosensitive circuit ink for high-order HDI and IC packaging substrates has achieved batch supply to companies such as Victory Giant Technology, Shennan Circuits, and WUS Printed Circuit. Guangxin Materials' LDI-specific inner-layer coating ink is compatible with all exposure equipment—particularly existing LDI imaging exposure machines on the market—and exhibits stronger absorption of ultraviolet light at 365–420 nm wavelengths; it has already achieved sales.

Against the backdrop of explosive growth in AI computing power and the high-end upgrading of PCBs, the market size of LDI inner-layer photosensitive circuit ink is expected to grow further in the coming years.

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