OFILM Reinvests in Zhongke Daojing to Drive TGV Technology into Semiconductor Packaging

11/10 2026 461

OFILM has once again invested in Hefei Zhongke Daojing Technology Co., Ltd., though the exact amount remains undisclosed.


Business registration records show that Zhongke Daojing completed a registration change on November 4, 2026, adding Series A financing information with OFILM listed as the investor. Founded just over three years ago, the company focuses on the R&D, production, and sales of through-glass via (TGV) technology, specializing in precision processing techniques for glass wafers. It is located in Feixi County, Hefei City, Anhui Province.

Zhongke Daojing previously secured investment from the Hefei Seed Fund on November 20, 2023, and from the Feixi Zipeng Fund on March 8, 2024—both angel rounds. OFILM's latest investment marks a further step forward in the company's financing journey.

Notably, OFILM had already acquired a 51% post-investment equity stake in Zhongke Daojing in August 2026 through a combination of "transfer of old shares and capital increase," becoming its controlling shareholder. This Series A round is therefore better understood as a follow-on investment after gaining control.

From a strategic standpoint, this investment aligns with OFILM's "optical core" strategy. The company noted in investor communications that by controlling Zhongke Daojing, it can rapidly establish the core processes for glass substrate advanced packaging and extend its optical precision manufacturing capabilities into the semiconductor packaging segment.

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